Semiconductor device

Details Semiconductor device Semiconductor device

2006-04-25

2006-04-25

Nelms, David (Department: 2818)

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

C257S200000, C257S698000, C361S306100

Reexamination Certificate

active

07035081

ABSTRACT:
The invention eliminates a need to increase a size of a semiconductor device and reduces occurrence of noise. A semiconductor device of the invention includes: a base (5) having front layers (9, 11) provided on respective sides of a core layer (7) formed by a printed circuit board, and a semiconductor chip (1) mounted on the base (5), wherein the semiconductor chip (1) is joined to one (9) of the front layers by using a joining member (3), and the other front layer (11) has a plurality of external terminals (55) arranged thereon, and the core layer (7) has a plurality of through-holes (41, 43, 45, 75, 77) formed therein to electrically connect the semiconductor chip (1) to the plurality of external terminals (55) together, and the plurality of through-holes (41, 43, 45, 75, 77) include a plurality of arrayed through-holes (41, 43, 45) arranged correspondingly to the arrangement of the plurality of external terminals (55) and one or more additional through-holes (75, 77) formed between the plurality of arrayed through-holes (41, 43, 45).

REFERENCES:
patent: 5331514 (1994-07-01), Kuroda
patent: 6388207 (2002-05-01), Figueroa et al.
patent: 6611419 (2003-08-01), Chakravorty

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