Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate
2005-11-22
2005-11-22
Nelms, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With semiconductor element forming part
C257S667000, C257S676000
Reexamination Certificate
active
06967396
ABSTRACT:
A semiconductor device in which a lead frame having inner connecting portions and outer connecting portions, a semiconductor chip having electrodes on the surface thereof, and metal wires for electrically connecting electrodes on the semiconductor chip and the inner connecting portions of the lead frame are sealed with a sealing resin. The bottom side of the sealing resin of the inner connecting portion is covered with an inner connecting portion sealing resin.
REFERENCES:
patent: 5942794 (1999-08-01), Okumura et al.
patent: 6081029 (2000-06-01), Yamaguchi
patent: 6175150 (2001-01-01), Ichikawa et al.
patent: 6198171 (2001-03-01), Huang et al.
patent: 6201294 (2001-03-01), Lee
patent: 6204554 (2001-03-01), Ewer et al.
patent: 6208020 (2001-03-01), Minamio et al.
patent: 6208023 (2001-03-01), Nakayama et al.
patent: 6247229 (2001-06-01), Glenn
patent: 6281568 (2001-08-01), Glenn et al.
patent: 6399423 (2002-06-01), Matsuura et al.
patent: 6437429 (2002-08-01), Su et al.
patent: 6521987 (2003-02-01), Glenn et al.
patent: 6713849 (2004-03-01), Hasebe et al.
patent: 2002/0024127 (2002-02-01), Sakuraba et al.
Nguyen Dao H.
Rabin & Berdo PC
Rohm & Co., Ltd.
LandOfFree
Semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3492407