Semiconductor device

Details Semiconductor device Semiconductor device

2005-11-22

2005-11-22

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With semiconductor element forming part

C257S667000, C257S676000

Reexamination Certificate

active

06967396

ABSTRACT:
A semiconductor device in which a lead frame having inner connecting portions and outer connecting portions, a semiconductor chip having electrodes on the surface thereof, and metal wires for electrically connecting electrodes on the semiconductor chip and the inner connecting portions of the lead frame are sealed with a sealing resin. The bottom side of the sealing resin of the inner connecting portion is covered with an inner connecting portion sealing resin.

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patent: 2002/0024127 (2002-02-01), Sakuraba et al.

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