Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S667000, C257S676000

Reexamination Certificate

active

06967396

ABSTRACT:
A semiconductor device in which a lead frame having inner connecting portions and outer connecting portions, a semiconductor chip having electrodes on the surface thereof, and metal wires for electrically connecting electrodes on the semiconductor chip and the inner connecting portions of the lead frame are sealed with a sealing resin. The bottom side of the sealing resin of the inner connecting portion is covered with an inner connecting portion sealing resin.

REFERENCES:
patent: 5942794 (1999-08-01), Okumura et al.
patent: 6081029 (2000-06-01), Yamaguchi
patent: 6175150 (2001-01-01), Ichikawa et al.
patent: 6198171 (2001-03-01), Huang et al.
patent: 6201294 (2001-03-01), Lee
patent: 6204554 (2001-03-01), Ewer et al.
patent: 6208020 (2001-03-01), Minamio et al.
patent: 6208023 (2001-03-01), Nakayama et al.
patent: 6247229 (2001-06-01), Glenn
patent: 6281568 (2001-08-01), Glenn et al.
patent: 6399423 (2002-06-01), Matsuura et al.
patent: 6437429 (2002-08-01), Su et al.
patent: 6521987 (2003-02-01), Glenn et al.
patent: 6713849 (2004-03-01), Hasebe et al.
patent: 2002/0024127 (2002-02-01), Sakuraba et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3492407

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.