Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-10-18
2005-10-18
Cuneo, Kamand (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S794000, C361S306100, C257S303000
Reexamination Certificate
active
06956747
ABSTRACT:
There is disclosed a semiconductor device comprising at least one first pad being formed above a substrate and given a first potential, at least one first conductive layer being formed between the first pad and the substrate so as to be electrically connected to the first pad, at least one second pad being formed above the substrate so as to sandwich the at least one first conductive layer between the second pad and the substrate, and given a second potential different from the first potential, at least one second conductive layer being formed between the first and second pads and the substrate so as to be electrically connected to the second pad, and a plurality of insulating layers being stacked on the substrate and at least one of the insulating layers being as an inter-electrode insulator of a capacitance element.
REFERENCES:
patent: 6333239 (2001-12-01), Aitken et al.
patent: 6399974 (2002-06-01), Ohtsuki
patent: 6617208 (2003-09-01), Saran
patent: 6-5705 (1994-01-01), None
patent: P2002-83933 (2002-03-01), None
patent: P2003-124336 (2003-04-01), None
Hiraoka Takayuki
Shigyo Naoyuki
Watanabe Kentaro
Cuneo Kamand
Dinh Tuan
Kabushiki Kaisha Toshiba
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