Semiconductor device

Details Semiconductor device Semiconductor device

2005-10-18

2005-10-18

Clark, S. V. (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

C257S780000

Reexamination Certificate

active

06956293

ABSTRACT:
There is provided a semiconductor device having a wafer-level package structure in which CSP structures are formed at a wafer level, which comprises a semiconductor substrate, an electrode pad formed over the semiconductor substrate, and a tail terminal formed to have an area that is smaller than the electrode pad and connected electrically to the electrode pad.

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patent: 2001-57374 (2001-02-01), None

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