Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2005-04-26
2005-04-26
Eckert, George (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S690000, C257S691000, C257S692000, C257S720000, C257S723000, C257S784000, C361S813000, C361S820000, C361S832000, C361S829000
Reexamination Certificate
active
06885097
ABSTRACT:
A board-shaped thermal conductor base board (3) is arranged on the bottom surface of a power module (1). Substrates (4) and (5) are arranged on the top surface of the thermal conductor base board (3), and semiconductor elements (6) and (7) are respectively arranged on the top surfaces of the substrates (4) and (5). The semiconductor elements (6, 7) are surrounded by a resinous case (2). A source electrode (13) is attached above and apart from the semiconductor elements (6, 7) by using the resinous case (2). The connection between the source electrode (13) and the sources of the semiconductor elements (7) are connected by wire bonding.
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Kono Eiji
Maeno Kazuhiro
Chu Chris C.
Eckert George
Kabushiki Kaisha Toyota Jidoshokki
Woodcock & Washburn LLP
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