Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1996-03-11
1997-07-01
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257705, 257712, 257713, 361702, H01L 2310, H01L 2334, H05K 720
Patent
active
056441630
ABSTRACT:
In a semiconductor device, a heat sink is fitted in an opening in a ceramics plate and a semiconductor element is mounted on the heat sink. A cap is fixed by a sealing ring to the surface of the ceramics plate so as to protect the semiconductor element. Connection pins are provided on the outer marginal surface portion of the ceramics plate. The opening of the ceramics plate is square in configuration and has a curvature radius R of R=1.0 mm at its corners, that is, has no angular corners, so that stress, being produced at the corner, is relieved.
Clark Jhihan B.
Kabushiki Kaisha Toshiba
Saadat Mahshid D.
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