Semiconductor device

Details Semiconductor device Semiconductor device

2002-03-27

2004-01-13

Lebentritt, Michael S. (Department: 2824)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S778000, C257S780000

Reexamination Certificate

active

06677677

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to a semiconductor device having a flip chip structure that uses function bumps. Particularly, this invention relates to a semiconductor device in which a reliability of junction of the function bumps is enhanced.
BACKGROUND OF THE INVENTION
FIG. 15
shows an example of a disposition of function bumps
200
on a chip
100
of a conventional semiconductor device. As shown in
FIG. 16
, there is a conductor between the chip
100
and the function bump
200
, and the function bump
200
is placed on a conductor
400
a
provided on a chip mounting member, e.g., a mounting substrate
400
. Then, the conductors
100
a
and
400
a
are connected by heating and pressurizing the chip
100
. An upper surface of the substrate
400
is coated with a protective film
600
.
However, when ultrasonic vibration is applied to the chip
100
as in an ultrasonic thermocompression bonding method, there is an adverse possibility that the chip
100
is bent in a vertical direction by the pressurizing force. As a result, if the bumps
200
are non-uniformly distributed as shown in
FIG. 15
, possibility of a portion having a low-density of function bumps, for example a corner portions
120
shown by a dotted-line circle in
FIG. 15
, getting bent becomes large. Because of such bending, satisfactory connection at the function bumps
200
is not achieved.
SUMMARY OF THE INVENTION
It is an object of the invention to obtain a semiconductor device capable of suppressing bending of a chip to enhance the connection at the function bumps.
The semiconductor device according to the present invention has a flip chip structure. The chip is electrically connected to the chip mounting member via function bumps provided on the chip. Dummy bumps acting against a local bending force of the chip are interposed between the chip and the chip mounting member. When the chip is pressurized to the chip mounting member, the supporting member acts against the pressurizing force applied to the chip.
Other objects and features of this invention will become apparent from the following description with reference to the accompanying drawings.


REFERENCES:
patent: 5176853 (1993-01-01), Sarma et al.
patent: 5400950 (1995-03-01), Myers et al.
patent: 5602419 (1997-02-01), Takeda et al.
patent: 5666008 (1997-09-01), Tomita et al.
patent: 6265766 (2001-07-01), Moden
patent: 6273328 (2001-08-01), Maeda et al.
patent: 6329383 (2001-12-01), Hedgecock et al.
patent: 6333561 (2001-12-01), Chen
patent: 61-224428 (1986-10-01), None
patent: 1-151182 (1989-06-01), None
patent: 1-238148 (1989-09-01), None
patent: 7-263490 (1995-10-01), None
patent: 8-102465 (1996-04-01), None
patent: 9-115910 (1997-05-01), None
patent: 2000-243785 (2000-09-01), None

Affiliated with

Also associated with

Rating

Semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3192398