Semiconductor device

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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Details

361767, 174250, H05L 102

Patent

active

053290682

ABSTRACT:
An insulating film is formed on a semiconductor substrate, and an Al electrode pad is provided on the insulating film. The pad is electrically connected to a positive element by means of a signal line. A protection film is formed on the pad and insulating film. First and second openings are formed in the protection film. A barrier metal layer is formed on the inner periphery of the first opening and on the protection film. An Au bump is formed on the barrier metal layer. The Al electrode pad is exposed through the second opening.

REFERENCES:
patent: 4461077 (1984-07-01), Hargis
patent: 4860442 (1989-08-01), Ainsworth et al.
patent: 5004314 (1991-04-01), Jackson et al.

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