Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1996-02-28
1998-08-11
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257713, 257717, 257719, 257723, 257706, 257787, 257793, 257796, H01L 2334, H01L 2310, H01L 2328, H01L 2329
Patent
active
057931062
ABSTRACT:
A semiconductor device, suitable for use in an invertor device for large currents in which IGBT chips are used and of which a high reliability is required, has an insulating plate on which are mounted semiconductor chips, a resin case enclosing the semiconductor chips, a filler resin filled into the resin case and covering the semiconductor chips and filling in the space between the semiconductor chips and the resin case, and a heatsink to which the insulating plate is attached, wherein, for purposes of attaching the insulating plate to the heatsink, the resin case is used to press the insulating plate onto the heatsink. Some benefits of this construction are that is makes it possible to eliminate the problem of fatigue failure of a solder layer previously used for attaching the insulating plate to the heatsink by dispensing with that solder layer, while at the same time improving the transfer of heat from the insulating plate to the heatsink, and thereby improving the removal of heat from the device. The construction also makes it possible to reduce cracking of the insulating plate, reduce breakage of mounting portions of the resin case and to use the device to make a small, thin, light and highly reliable invertor device.
REFERENCES:
patent: 5258649 (1993-11-01), Tanaka et al.
Webster's II New Riverside University Dictionary.
Fujieda Nobuo
Kuwahara Heikichi
Muso Masanori
Naito Shotaro
Suzuki Osamu
Clark Jhihan B.
Hitachi , Ltd.
Saadat Mahshid D.
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