Semiconductor copper line cutting method

Details Semiconductor copper line cutting method Semiconductor copper line cutting method

2006-01-17

2006-01-17

Zarabian, Amir (Department: 2822)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C438S742000, C216S066000, C216S078000, C204S192340, C204S298360

Reexamination Certificate

active

06987067

ABSTRACT:
A method of repairing a semiconductor chip containing copper is taught, whereby copper is selectively removed from the chip. The method involves processing the chip inside a chamber in which the chip is exposed to various gases and an energy source, such as a focused ion beam. To the extent the chip may have non-copper materials, such as nitride and oxide layers, on top of the copper that is to be removed, those non-copper materials will first be selectively removed. Such removal typically results in a hole (a so-called “elevator shaft”) leading to the copper that is to be removed. Next, the method teaches the introduction of a combination of nitrogen and oxygen into the chamber and the directing of the ion beam at the spot where the copper is to be removed. In this manner, the copper on the chip is cleanly and reliably removed, without causing damage to the processing chamber.

REFERENCES:
patent: 4609809 (1986-09-01), Yamaguchi
patent: 5171709 (1992-12-01), Donelon
patent: 5182230 (1993-01-01), Donelon
patent: 6004437 (1999-12-01), Lee
patent: 6077618 (2000-06-01), Sakakima
patent: 6159859 (2000-12-01), Robertson, III et al.
patent: 6410418 (2002-06-01), Yang
patent: 6509276 (2003-01-01), Scott
patent: 6641705 (2003-11-01), Phaneuf et al.

Affiliated with

Also associated with

Rating

Semiconductor copper line cutting method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor copper line cutting method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor copper line cutting method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3536527