Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-03-13
2009-08-25
Gandhi, Jayprakash N (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S080400, C165S080500, C165S104330, C174S015100, C257S714000, C062S064000, C062S259200
Reexamination Certificate
active
07580261
ABSTRACT:
A cooling system is provided for use in conjunction with a semiconductor assembly including a first semiconductor device and a second semiconductor device electrically coupled to the first semiconductor device by an elongated electrical connection. The cooling system includes a flow passage, a pump fluidly coupled to the flow passage, and an outlet array fluidly coupled to the flow passage and configured to direct a coolant fluid over the second semiconductor device. The outlet array has an interconnect feature formed therein configured to receive the elongated electrical connection there through.
REFERENCES:
patent: 6445568 (2002-09-01), Baur et al.
patent: 7477513 (2009-01-01), Cader et al.
John George
Nelson David F.
Smith Gregory Scott
Ward Terence G.
Yankoski Edward P
Gandhi Jayprakash N
GM Global Technology Operations Inc.
Pape Zachary M
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