Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2006-06-27
2006-06-27
Clark, S. V. (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S706000, C257S930000, C438S122000
Reexamination Certificate
active
07067913
ABSTRACT:
A cooling device for an element such as a microprocessor in a computer, and a process for manufacturing the cooling device. The cooling device provides an effective structure of cooling a microprocessor by providing a metallic filler layer and a metal plate layer spreading out heat generated from the microprocessor, and thereby effectively thermally conducting heat away from the microprocessor. Further, a semiconductor thermoelectric module can be utilized to further cool the microprocessor.
REFERENCES:
patent: 5637921 (1997-06-01), Burward-Hoy
patent: 6249434 (2001-06-01), Scafidi
patent: 6667548 (2003-12-01), O'Connor et al.
patent: 6727422 (2004-04-01), Macris
patent: 6748350 (2004-06-01), Rumer et al.
Adar Eliezer
Gotlib Vladimir
Clark S. V.
DTNR Ltd.
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
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