Heat exchange – With valve or movable deflector for heat exchange fluid flow – With by-pass of heat exchanger or heat exchanger section
Patent
1987-01-12
1990-02-06
Hille, Rolf
Heat exchange
With valve or movable deflector for heat exchange fluid flow
With by-pass of heat exchanger or heat exchanger section
16510433, 361385, H01L 2504
Patent
active
048992119
ABSTRACT:
A cooling mechanism for power semiconductors comprises a metallic evaporator (1) filled with a heat-carrying fluid and designed to be brought into close contact with one face of a smeiconductor (2); at least one condenser constituted by a tube (5) whose inner wall bears a capillary structure, and which is closed at one end and extended at the other end by a conduit (7) of insulating material; and an envelope (8) enclosing the tube (5) and attached at the upper part of the conduit (7) so as to create a chamber (11) for the circulation of a cooling fluid, with the conduit (7) being connected to the evaporator (1) by an elastic piece (14). The pressure inside the assembly constituted by the evaporator (1), the condenser(s) (5) and the conduit (7) is lower than atmospheric pressure, and cooling is effected by an evaporation-condensation cycle.
REFERENCES:
patent: 3792318 (1974-02-01), Fries et al.
patent: 4036291 (1977-07-01), Kobayashi et al.
patent: 4126883 (1978-11-01), Martin
patent: 4188996 (1980-02-01), Pellant et al.
patent: 4561040 (1985-12-01), Eastman et al.
patent: 4574877 (1986-03-01), Klein
"Cooling Device for Multilayer Ceramic Modules", B. T. Clark et al., IBM Technical Disclosure Bulletin, vol. 20, No. 5, Oct. 1977, pp. 1769-1771.
Hille Rolf
Jeumont Schneider Corporation
Loke Steven
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