Semiconductor cooling device and stack of semiconductor...

Details Semiconductor cooling device and stack of semiconductor... Semiconductor cooling device and stack of semiconductor...

2008-04-29

2008-04-29

Zarroli, Michael C. (Department: 2839)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S699000, C257S706000

Reexamination Certificate

active

11094191

ABSTRACT:
To prevent occurrence of distortion in a semiconductor cooling device and to prevent a semiconductor chip from being separated away from the semiconductor cooling device in case the semiconductor chip and the semiconductor cooling device are thermally expanded, a semiconductor cooling device includes at least an upper plate, an intermediate plate and a lower plate, and has a coolant inlet portion, an outlet portion and a flow passage portion. The upper plate and the lower plate are composite plates constituted by plating copper maintaining a thickness of not smaller than 0.05 mm on one surface or on both surfaces of auxiliary plates made of a material having a tensile strength of not smaller than 1000 N/mm2, a heat conductivity of not smaller than 100 W/m·K and a coefficient of thermal expansion of not larger than 6.0 ppm/° C.

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patent: 7114550 (2006-10-01), Nakahama et al.
patent: 2006/0108100 (2006-05-01), Goldman et al.
patent: 11-97770 (1999-04-01), None

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