Refrigeration – Structural installation – With electrical component cooling
Reexamination Certificate
2005-07-12
2005-07-12
Tapolcai, William E. (Department: 3744)
Refrigeration
Structural installation
With electrical component cooling
C165S104330, C361S695000, C361S699000, C361S698000
Reexamination Certificate
active
06915653
ABSTRACT:
A semiconductor cooling device includes a cold plate for cooling a semiconductor element, a condenser, and an inverter-controlled refrigerant pump, all of which are fluid connected in series with each other to define a refrigerating cycle. The semiconductor cooling device also includes a fan for cooling the condenser, a temperature detector disposed in proximity to the semiconductor element, and a controller for controlling the refrigerant pump and the fan. The controller controls the number of revolutions of the refrigerant pump and that of the fan depending on a value measured by the temperature detector.
REFERENCES:
patent: 4812733 (1989-03-01), Tobey
patent: 5455458 (1995-10-01), Quon et al.
patent: 5729995 (1998-03-01), Tajima
patent: 5747728 (1998-05-01), Fleurial et al.
patent: 5859763 (1999-01-01), Nam et al.
patent: 5871859 (1999-02-01), Parise
patent: 6057050 (2000-05-01), Parise
patent: 6101815 (2000-08-01), van Oort et al.
patent: 6158232 (2000-12-01), Tsuji et al.
patent: 6367543 (2002-04-01), Calaman et al.
patent: 6458319 (2002-10-01), Caillat et al.
patent: 6578626 (2003-06-01), Calaman et al.
patent: 6623596 (2003-09-01), Collins et al.
patent: 405121604 (1993-05-01), None
patent: 406037219 (1994-02-01), None
patent: 2000-208683 (2000-07-01), None
Ashitani Hiromasa
Ikeda Akira
Nakano Masao
Matsushita Electric - Industrial Co., Ltd.
RatnerPrestia
LandOfFree
Semiconductor cooling device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor cooling device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor cooling device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3395471