Semiconductor contact structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Reexamination Certificate

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Details

C257S207000, C257S208000, C257S211000, C257S686000, C257S698000, C257S758000, C257S759000, C257S760000

Reexamination Certificate

active

07466028

ABSTRACT:
A semiconductor device structure for a three-dimensional integrated circuit is provided. The semiconductor device structure includes: a substrate having a first surface and a second surface; a via defined in the substrate and extending from the first surface to the second surface; and a first plurality of contact structures on the first surface contacting the via. A cross section of each of the first plurality of contact structures parallel to the first surface has a first side and a second side, and a ratio of the longer side to the shorter side of the first side and the second side is more than about 2:1.

REFERENCES:
patent: 5699611 (1997-12-01), Kurogi et al.
patent: 6759738 (2004-07-01), Fallon et al.
patent: 6903443 (2005-06-01), Farnworth et al.
patent: 7061116 (2006-06-01), McCormick et al.
patent: 2004/0007376 (2004-01-01), Urdahl et al.
patent: 2008/0099770 (2008-05-01), Mendendorp et al.

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