Semiconductor connection components and method with releasable l

Details Semiconductor connection components and method with releasable l Semiconductor connection components and method with releasable l

1994-06-29

1996-02-06

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174260, 174262, 361760, 361774, 361783, 439 84, 439 78, 29835, 29832, H05K 118

Patent

active

054897491

ABSTRACT:
A connection component for electrically connecting a semiconductor chip to a support substrate incorporates a preferably dielectric supporting structure defining gaps. Leads extend across these gaps so that the leads are supported on both sides of the gap. The leads therefore can be positioned approximately in registration to contacts on the chip by aligning the connection component with the chip. Each lead is arranged so that one end can be displaced relative to the supporting structure when a downward force is applied to the lead. This allows the leads to be connected to the contacts on the chip by engaging each lead with a tool and forcing the lead downwardly against the contact. Preferably, each lead incorporates a frangible section adjacent one side of the gap and the frangible section is broken when the lead is engaged with the contact. Final alignment of the leads with the contacts on the chip is provided by the bonding tool, which has features adapted to control the position of the lead.

REFERENCES:
patent: 2758797 (1956-08-01), Miklau
patent: 3374537 (1968-03-01), Doelp, Jr.
patent: 3460105 (1969-08-01), Birt et al.
patent: 3822465 (1974-07-01), Frankort et al.
patent: 4030657 (1977-06-01), Scheffer
patent: 4069961 (1978-01-01), Nicklaus et al.
patent: 4141712 (1979-02-01), Rogers
patent: 4234666 (1980-11-01), Gursky
patent: 4312926 (1982-01-01), Burns
patent: 4320570 (1982-03-01), Brower et al.
patent: 4331740 (1982-05-01), Burns
patent: 4380042 (1983-04-01), Angelucci, Sr. et al.
patent: 4413404 (1983-11-01), Burns
patent: 4435741 (1984-03-01), Shimizu et al.
patent: 4616412 (1986-10-01), Schroeder
patent: 4633583 (1987-01-01), Kato
patent: 4756080 (1988-07-01), Thorn, Jr. et al.
patent: 4776509 (1988-12-01), Pitts et al.
patent: 4812421 (1989-03-01), Jung et al.
patent: 4859806 (1989-08-01), Smith
patent: 4887758 (1989-12-01), Suzuki et al.
patent: 4989069 (1991-01-01), Hawkins
patent: 5007576 (1991-04-01), Congleton et al.
patent: 5057461 (1991-10-01), Fritz
patent: 5059559 (1991-10-01), Takahashi et al.
patent: 5127570 (1992-07-01), Steitz et al.
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5148266 (1992-09-01), Khandros et al.
patent: 5148967 (1992-09-01), Gabaldon et al.
patent: 5156318 (1992-10-01), Suzuki et al.
patent: 5173574 (1992-12-01), Kraus
patent: 5177863 (1993-01-01), Lam
patent: 5193732 (1993-03-01), Interrante et al.
patent: 5217154 (1993-06-01), Elwood et al.
patent: 5225633 (1993-07-01), Wigginton
patent: 5252784 (1993-10-01), Asai et al.
patent: 5390844 (1995-02-01), DeStefano et al.
"Recent Advances in Single Point Tab Bonding tools", by Jerry Carlson Microminiature Technology, Inc. copywrite 1990.

Affiliated with

Also associated with

Rating

Semiconductor connection components and method with releasable l does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor connection components and method with releasable l, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor connection components and method with releasable l will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2176435