Semiconductor connection and crossover apparatus

Details Semiconductor connection and crossover apparatus Semiconductor connection and crossover apparatus

1987-02-12

1988-03-15

Tolin, G. P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

357 80, 357 81, 361401, H05K 720

Patent

active

047317000

ABSTRACT:
A ceramic member with thick film conductors is mounted on a heat sink and a silicon integrated circuit (chip) is placed through a hole in the ceramic member and is soldered by a back surface (the substrate) to the heat sink. A tape automated bonding lead frame is used to provide conductors that are soldered to bonding pads on the ceramic member and are compression bonded to conductive bumps on the chip and to provide other conductors that are soldered to pads on the ceramic member and crossover a front active surface of the chip. These crossover conductors are air isolated from the chip and allow an increase in interconnect density. The attachment of the semiconductor substrate to the heat sink provides good heat dissipation.

REFERENCES:
patent: 3374537 (1968-03-01), Doelp, Jr.
patent: 3480836 (1969-11-01), Aronstein
patent: 3646246 (1972-02-01), Olney, Jr.
patent: 3833838 (1974-09-01), Christiansen
patent: 4320438 (1982-03-01), Ibrahim
patent: 4404059 (1983-09-01), Livshits
patent: 4472876 (1984-09-01), Nelson
patent: 4595945 (1986-06-01), Graver
patent: 4654694 (1987-03-01), Val
patent: 4663649 (1987-05-01), Suzuki
An unidentified photo showing views of Wire Bonding, Direct Mount TAB, and Double Density TAB.

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