Semiconductor connecting device and method for making the same

Details Semiconductor connecting device and method for making the same Semiconductor connecting device and method for making the same

1996-04-18

1998-05-19

Niebling, John

Fishing, trapping, and vermin destroying

437190, 437192, 437200, 1566551, 1566561, H01L 21441

Patent

active

057535345

ABSTRACT:
The semiconductor connecting device comprises a first conductive layer to be connected electrically; an insulating film covering the first conductive layer in such a way as to expose a predetermined portion of the first conductive layer, resulting in forming a contact hole; a conductive material pad formed in the contact hole so as to be connected with the first conductive layer, extending in a limited way over the upper surface of the insulating film; a second conductive layer formed on the extended conductive material pad, being connected with the first conductive layer; an etching barrier material formed on said conductive material pad of said contact hole and a part of the extending region, said second conductive layer being formed on the region both of said conductive material pad which is not covered with said etching barrier material and which is covered by said etching barrier material.

REFERENCES:
patent: 4844776 (1989-07-01), Lee et al.
patent: 5162259 (1992-11-01), Kolar et al.
patent: 5298792 (1994-03-01), Manning
patent: 5410175 (1995-04-01), Kalnitsky
patent: 5420058 (1995-05-01), Lee et al.
patent: 5427980 (1995-06-01), Kim
patent: 5550085 (1996-08-01), Lui
B. Cohen et al. "Low Temperature Rapid Thermal Formation of Tin Barrier Layers" Rapid Thermal Processing of Electronic Materials Symposium (Apr. 1987) pp. 171-176.
Sze et al, Semiconductor Devices . . . , pp. 461-465, 1985.
S. M. Sze, et al., Semiconductor Devices, Physics and Technology, 1985, pp. 461-465.

Affiliated with

Also associated with

Rating

Semiconductor connecting device and method for making the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor connecting device and method for making the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor connecting device and method for making the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1852462