Semiconductor configuration and method for fabricating the...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means

Reexamination Certificate

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C257S513000, C257S506000, C257S501000

Reexamination Certificate

active

06838746

ABSTRACT:
The invention proposes a semiconductor configuration having a substrate, which has at least one component integrated therein. The substrate has a first main side with a metalization. At least parts of the metalization are underlaid with an insulation layer located in the substrate. By virtue of the fact that the insulation layer is realized in the form of a trench lattice, it is possible to reduce parasitic capacitances and undesirable signal power losses in the case of high-frequency signals.

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Erzgräber, H. B. et al.: “A Novel Buried Oxide Isolation for Monolithic RF Inductors on Silicon”, IEEE, 1998, pp. 535-539.

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