Semiconductor composite device, method for manufacturing the...

Details Semiconductor composite device, method for manufacturing the... Semiconductor composite device, method for manufacturing the...

2008-08-29

2010-10-12

Pert, Evan (Department: 2826)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

C438S455000

Reexamination Certificate

active

07811841

ABSTRACT:
A semiconductor composite apparatus includes a semiconductor thin film and a metal layer formed on a substrate. The semiconductor thin film is bonded to the metal layer formed on the substrate. A region is formed between the semiconductor thin film and the metal surface, and contains an oxide of a metal that forms the metal surface. The metal surface is a surface of a metal layer provided on the substrate. The metal surface contains an element selected from the group consisting of Pd, Ni, Ge, Pt, Ti, Cr, and Au. The metal surface is coated with either a Pd layer or an Ni layer.

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