Semiconductor composite device, LED head that employs the...

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Heterojunction

Reexamination Certificate

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Details

C257S094000, C257S096000, C257S099000

Reexamination Certificate

active

07432523

ABSTRACT:
A semiconductor composite apparatus includes a semiconductor thin film and a metal layer formed on a substrate. The semiconductor thin film is bonded to the metal layer formed on the substrate. A region is formed between the semiconductor thin film and the metal surface, and contains an oxide of a metal that forms the metal surface. The metal surface is a surface of a metal layer provided on the substrate. The metal surface contains an element selected from the group consisting of Pd, Ni, Ge, Pt, Ti, Cr, and Au. The metal surface is coated with either a Pd layer or an Ni layer.

REFERENCES:
patent: 5798537 (1998-08-01), Nitta
patent: 7078729 (2006-07-01), Suzuki et al.
patent: 2005/0112805 (2005-05-01), Goto et al.
patent: 1397984 (2003-02-01), None
patent: 1449060 (2003-10-01), None
patent: 11-186598 (1999-07-01), None

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