Semiconductor component with several semiconductor elements

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357 81, H01L 2342, H01L 2302

Patent

active

043815189

ABSTRACT:
Semiconductor component with a plurality of semiconductor elements disposed in a case having a metallic bottom being in heat-conducting contact with the semiconductor elements, electrical leads, and a leaf spring having ends and providing electrical pressure contact between the semiconductor elements and the leads, including yokes each holding a respective end of the spring, and at least two screws anchoring the yokes and the semiconductor elements to the bottom.

REFERENCES:
patent: 2728881 (1950-03-01), Jacobi
patent: 3418543 (1968-12-01), Marino et al.
patent: 3740618 (1973-06-01), Vogel
patent: 3755719 (1973-08-01), Wilcox
patent: 3982308 (1976-09-01), Yoneda
patent: 4069497 (1978-01-01), Steidlitz
patent: 4159483 (1979-06-01), Bettin
patent: 4263607 (1981-04-01), Legrand et al.

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