Semiconductor component with MIM capacitor

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

Reexamination Certificate

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C257S532000, C257S499000

Reexamination Certificate

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07659602

ABSTRACT:
A structure and method of forming a capacitor is described. In one embodiment, the capacitor includes a cylindrical first electrode having an inner portion bounded by a bottom surface and an inner sidewall surface, the first electrode further having an outer sidewall, the first electrode being formed from a conductive material. An insulating fill material is disposed within the inner portion of the first electrode. A capacitor dielectric is disposed adjacent at least a portion of the outer sidewall of the first electrode. A second electrode is disposed adjacent the outer sidewall of the first electrode and separated therefrom by the capacitor dielectric. The second electrode is not formed within the inner portion of the first electrode.

REFERENCES:
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patent: 6175130 (2001-01-01), Hosotani et al.
patent: 6853024 (2005-02-01), Tu
patent: 2002/0105048 (2002-08-01), Matsushita et al.
patent: 2003/0203588 (2003-10-01), Song et al.
patent: 2004/0235260 (2004-11-01), Lee et al.
patent: 10-0418587 (2004-02-01), None
Suzuki et al. “Linear-Supported Cylinder (LST) Technology to realize Ru/Ta2O5/Ru Capacitor for Future DRAMs”, 2000, IEDM, pp. 793-796.

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