Semiconductor component with connecting elements and method...

Details Semiconductor component with connecting elements and method... Semiconductor component with connecting elements and method...

2006-11-09

2009-08-04

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C438S124000, C438S126000, C438S462000, C438S464000, C438S465000, C257SE21502, C257SE21503

Reexamination Certificate

active

07569427

ABSTRACT:
A semiconductor component with connecting elements between a semiconductor chip made from a semiconductor wafer with discrete semiconductor components and a superordinate circuit carrier is disclosed. The semiconductor component has a coplanar area having top sides of the connecting elements and a plastic housing composition. The connecting element has a mesa structure or a mushroom-shaped form for surface mounting. Moreover, the connecting element includes a structured nickel- and lead-free contact coating. The connecting element is arranged on contact areas of the semiconductor chip, the areal extent of the connecting elements corresponding to the contact areas of the semiconductor chip.

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