Semiconductor component package

Details Semiconductor component package Semiconductor component package

1994-04-29

1995-10-31

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257705, 257707, 257692, H01L 2302, H01L 2312

Patent

active

054632501

ABSTRACT:
A package for power semiconductor components permitting high thermal dissipation and current conductance and including a frame assembly bonded to a substrate on which a power semiconductor chip is mounted. The frame assembly has a wirebonding grid for connecting short, uniform length wirebonds to the surface of the chip. The grid is configured so as to have a portion overlaying and spaced from the chip a distance less than a distance required to connect a wirebond of optimal length to each anode cell of the chip. The package allows a high power semiconductor device to be used as a surface mount device or as a hockey puck.

REFERENCES:
patent: 3663868 (1972-05-01), Noguchi et al.
patent: 4922324 (1990-05-01), Sudo

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