Semiconductor component of semiconductor chip size with...

Details Semiconductor component of semiconductor chip size with... Semiconductor component of semiconductor chip size with...

2007-01-16

2007-01-16

Malsawma, Lex H. (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

Reexamination Certificate

active

10896993

ABSTRACT:
A semiconductor component and a method for its production in semiconductor chip size, can have a semiconductor chip, which has external contacts of the semiconductor component that are arranged in the manner of a flip-chip on its active upper side. The semiconductor chip can be encapsulated by a plastic compound at least on its rear side and its side edges. The outer contacts, which can be arranged on external contact connecting areas, can project from the active upper side.

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patent: 2001/0016400 (2001-08-01), Lee
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patent: 2003/0102538 (2003-06-01), Paulus
patent: 101 05 351 (2002-08-01), None
patent: WO 01/26146 (2001-04-01), None

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