Semiconductor component of semiconductor chip size with...

Details Semiconductor component of semiconductor chip size with... Semiconductor component of semiconductor chip size with...

2011-04-26

2011-04-26

Parker, Kenneth A (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S777000, C257S778000, C257S780000, C257S781000, C257S783000, C438S114000, C438S616000

Reexamination Certificate

active

07932599

ABSTRACT:
A semiconductor component and a method for its production in semiconductor chip size, can have a semiconductor chip, which has external contacts of the semiconductor component that are arranged in the manner of a flip-chip on its active upper side. The semiconductor chip can be encapsulated by a plastic compound at least on its rear side and its side edges. The outer contacts, which can be arranged on external contact connecting areas, can project from the active upper side.

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