Semiconductor component mounted by brazing

Details Semiconductor component mounted by brazing Semiconductor component mounted by brazing

1996-11-25

1998-08-18

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Regenerative type switching device

Having only two terminals and no control electrode , e.g.,...

257109, 257678, 257689, 257724, H01L 2987, H01L 2313, H01L 2960, H01L 2350

Patent

active

057961239

ABSTRACT:
A mesa-type semiconductor component including on at least one of its surfaces, in addition to a circumferential ring constituted by a portion of a passivating glass layer, at least one pad constituted by a portion of this layer and acting as a spacer.

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French Search Report from French Patent Application No. 95 14382, filed Nov. 30, 1995.
Patent Abstracts of Japan vol. 005, No. 082 (E-059) May 29, 1981 & JP-A-56 029335 (NEC Corp.).
Patent Abstracts of Japan, vol. 009. No. 008 (E-289), Jan. 12, 1985 & JP-A-59 155162 (Fujitsu KK).

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