Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2007-06-26
2007-06-26
Huynh, Andy (Department: 2818)
Semiconductor device manufacturing: process
With measuring or testing
C438S015000, C438S018000
Reexamination Certificate
active
10842770
ABSTRACT:
A semiconductor component having test pads and a method and apparatus for testing the same is described. In an example, an un-bumped substrate is obtained having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. In another example, a substrate is fabricated having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. An insulating layer is formed over the plurality of test pads.
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Bazargan Hassan K.
Cho Jae
Liang Shih-Liang
Mardi Mohsen Hossein
Stokes Sanjiv
Nguyen Thinh T
XILINX Inc.
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