Semiconductor component having leadframe with offset ground plan

Details Semiconductor component having leadframe with offset ground plan Semiconductor component having leadframe with offset ground plan

1997-08-11

1999-08-10

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361702, 361717, 361718, 257672, 257676, 257706, 257719, 257796, 257787, H05K 720

Patent

active

059368373

ABSTRACT:
A semiconductor component includes a leadframe (11, 40) having leads (12, 41) and a ground plane (13, 42) wherein the ground plane (13, 42) has an opening (15, 45). A semiconductor substrate (21) is located in the opening (15, 45) and is approximately coplanar with the ground plane (13, 42). The coplanarity shortens the ground plane wire bonds (23) and improves the electrical performance of the semiconductor component.

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