Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate
2005-09-27
2005-09-27
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With semiconductor element forming part
C257S666000, C257S696000, C257S698000, C257S691000, C257S796000, C257S730000, C257S787000, C257S670000, C257S784000, C257S786000, C257S676000, C257S675000, C257S775000, C257S776000, C257S734000, C174S050510
Reexamination Certificate
active
06949816
ABSTRACT:
A semiconductor component for electrical coupling to a substrate (230) includes: a semiconductor chip (110); a non-leaded leadframe (120) including a plurality of electrical contacts (130) located around a periphery (111) of the semiconductor chip; a first electrical conductor (140) electrically coupling together the semiconductor chip and the non-leaded leadframe; and a mold compound (210) disposed around the semiconductor chip, the first electrical conductor, and the plurality of electrical contacts. At least one electrical contact of the plurality of electrical contacts includes: a first surface (310) having a first surface area for electrically coupling to the semiconductor chip; and a second surface (320) opposite the first surface and having a second surface area for electrically coupling to the substrate, where the second surface area is larger than the first surface area.
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Brown Clem H.
Chow Wai Wong
Mosna, Jr. Frank J.
Bryan Cave LLP
Motorola Inc.
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