Semiconductor component having dummy segments with trapped...

Details Semiconductor component having dummy segments with trapped... Semiconductor component having dummy segments with trapped...

2007-09-04

2007-09-04

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257SE23043, C257SE21504, C257SE23125, C257SE23004, C257S788000, C257S667000, C257S687000, C264S272170, C264S316000, C264S272150, C425S544000, C425S572000, C425S588000, C425S116000, C425S089000, C425S394000, C425S117000, C438S127000, C438S123000

Reexamination Certificate

active

10949904

ABSTRACT:
A semiconductor component includes a leadframe, a die, upper and lower body segments encapsulating the die, and dummy segments on the leadframe. The dummy segments are configured to vent trapped air in a molding compound during molding of the body segments, such that corners of the body segments do not include the trapped air.

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