Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2011-08-16
2011-08-16
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257SE23080, C257SE21506, C257S704000, C257S710000, C257S667000, C257S778000, C257S737000, C257S738000, C257S680000, C257S668000, C257S717000, C257S720000, C257S713000
Reexamination Certificate
active
07999374
ABSTRACT:
A semiconductor component includes a semiconductor element that has a plurality of signals, a wiring board that is disposed below the semiconductor element and that draws the plurality of signals of the semiconductor element, a heat conduction member that dissipates heat generated by the semiconductor element, a joining member that is disposed between the semiconductor element and the heat conduction member and that joins the heat conduction member to the semiconductor element, a support member formed with an opening so as to surround the semiconductor element that supports the heat conduction member, a first adhesive member that is disposed between the support member and the wiring board to bond the support member with the wiring board and a second adhesive member that is disposed between the support member and the heat conduction member to bond the support member with the heat conduction member.
REFERENCES:
patent: 2995686 (1961-08-01), Selvin
patent: 5424918 (1995-06-01), Felps et al.
patent: 5959353 (1999-09-01), Tomita
patent: 6232652 (2001-05-01), Matsushima
patent: 7173329 (2007-02-01), Frutschy et al.
patent: 5-251980 (1993-09-01), None
patent: 9-293808 (1997-11-01), None
patent: 10-050877 (1998-02-01), None
patent: 10-144737 (1998-05-01), None
patent: 2000-106410 (2000-04-01), None
patent: 2003-218253 (2003-07-01), None
patent: 2004-296739 (2004-10-01), None
patent: 2006-80297 (2006-03-01), None
International Search Report for PCT/JP2007/056389, mailed Jun. 19, 2007.
English Translation of the International Preliminary Report on Patentability and Written Opinion, mailed Oct. 20, 2009 and issued in corresponding International Patent Application PCT/JP2007/056389.
Igawa Osamu
Kubo Hideo
So Tsuyoshi
Ueno Seiji
Fujitsu Limited
Fujitsu Patent Center
Williams Alexander O
LandOfFree
Semiconductor component having adhesive squeeze-out... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor component having adhesive squeeze-out..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor component having adhesive squeeze-out... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2707770