Semiconductor component having a semiconductor die and a...

Details Semiconductor component having a semiconductor die and a... Semiconductor component having a semiconductor die and a...

2006-09-07

2009-12-08

Nguyen, Thinh T (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S666000, C257S672000, C257SE23066, C438S121000, C438S123000

Reexamination Certificate

active

07629676

ABSTRACT:
A semiconductor component has a leadframe, a semiconductor die and an encapsulation element. The leadframe has a die pad having a first side, at least one lead spaced at a distance from the die pad and at least one support bar remnant protruding from the die pad, each having a distal end. The encapsulation element has plastic and encapsulates at least the semiconductor die and a portion of the first side of the die pad. At least one support bar remnant is positioned within the encapsulation element and the distal end of the support bar remnant is encapsulated by at least one dielectric compound.

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Jin Cai et al., “Vertical SiGe-Base Bipolar Transistors on CMOS-Compatible SOI Substrate”, Bipolar/BiCMOS Circuits and Techology Meeting, 2003, pp. 215-218, Published Sep. 2003.
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