Semiconductor component comprising leadframe, semiconductor...

Details Semiconductor component comprising leadframe, semiconductor... Semiconductor component comprising leadframe, semiconductor...

2006-07-11

2006-07-11

Vu, Hung (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S109000

Reexamination Certificate

active

07074647

ABSTRACT:
In one embodiment of the invention, a semiconductor component includes: a leadframe (110, 210, 310, 410) having a surface (111, 211, 311, 411); an integrated passive component (120, 220, 320, 420) located above the surface of the leadframe; a semiconductor chip (130, 230, 330, 430) electrically coupled to the integrated passive component and located above the surface of the leadframe; and a mold compound (140, 240, 340, 440) disposed around the semiconductor chip, the integrated passive component, and the leadframe. A portion (112, 212, 312, 412) of the leadframe is exposed outside of the mold compound. The integrated passive component comprises a passive device (121, 221, 321, 421). A direction (190, 290, 390, 490) perpendicular to the surface of the leadframe is a vertical direction, and the semiconductor chip, the integrated passive component, and the leadframe are arranged vertically with respect to each other.

REFERENCES:
patent: 5012386 (1991-04-01), McShane et al.
patent: 5200362 (1993-04-01), Lin et al.
patent: 5311057 (1994-05-01), McShane
patent: 6133637 (2000-10-01), Hikita et al.
patent: 6143981 (2000-11-01), Glenn
patent: 6175157 (2001-01-01), Morifuji
patent: 6281568 (2001-08-01), Glenn et al.
patent: 6507120 (2003-01-01), Lo et al.
patent: 6555917 (2003-04-01), Heo

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