Patent
1984-10-22
1987-07-14
James, Andrew J.
357 71, 357 65, 357 54, H01L 2350, H01L 2940
Patent
active
046806105
ABSTRACT:
A semiconductor component having bump-like, metallic lead contacts and multilayer wiring wherein individual tracks of each and every electrical signal or potential to be wired in multilayer wiring technology are electrically connected to the respective lead contact in the region thereof and to one another, but are separated from one another in the remaining regions of the semiconductor component by insulating layers. The various insulating layers terminate at different distances from the lead contacts in such fashion that their ends, depending upon the embodiment, form a funnel that tapers either down or up. The difference of the respective distance of the ends of two neighboring insulating layers from the corresponding lead contacts amounts to at least twice the thickness of one of the two layers. Given different layer thicknesses, a dimension of the thicker layer is used. An insulating layer may be at most 2 .mu.m thick, and preferably 1 .mu.m. Edge interruptions at the tracks and sputtering gaps and voids at the lead contacts which lead to contact causticization, corrosion, and subsequent electrical failure are thus avoided.
REFERENCES:
patent: 4263606 (1981-04-01), Yorikane
James Andrew J.
Lamont John
Siemens Aktiengesellschaft
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