Semiconductor component and system having stiffener and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Reexamination Certificate

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C257S690000, C257S693000, C257S793000

Reexamination Certificate

active

07061085

ABSTRACT:
A semiconductor component includes a stiffener, a circuit decal attached to the stiffener, and a semiconductor die attached to the stiffener. The circuit decal includes conductors which function as an internal signal transmission system for the component, and a mask layer which functions as a solder mask and an outer insulating layer for the component. An adhesive layer in physical contact with the conductors attaches the circuit decal to the stiffener, and electrically insulates the conductors from the stiffener. The component also includes an area array of terminal contacts on the conductors electrically isolated by the mask layer. A method for fabricating the component includes the steps of attaching the circuit decal to the stiffener, attaching the die to the stiffener, interconnecting the die and the circuit decal, encapsulating the die, and forming the terminal contacts.

REFERENCES:
patent: 5760465 (1998-06-01), Alcoe et al.
patent: 6020629 (2000-02-01), Farnworth et al.
patent: 6552427 (2000-02-01), Moden
patent: 6153924 (2000-11-01), Kinsman
patent: 6229202 (2001-05-01), Corisis
patent: 6229227 (2001-05-01), Muthukumaraswamy et al.
patent: 6310390 (2001-10-01), Moden
patent: 6326242 (2001-12-01), Brooks et al.
patent: 6326244 (2001-12-01), Brooks et al.
patent: 6355199 (2002-03-01), Briar et al.
patent: 6396141 (2002-05-01), Schueller et al.
patent: 6459144 (2002-10-01), Pu et al.
patent: 6462274 (2002-10-01), Shim et al.
patent: 6465877 (2002-10-01), Farnworth et al.
patent: 6482674 (2002-11-01), Kinsman
patent: 6489557 (2002-12-01), Eskildsen et al.
patent: 6506625 (2003-01-01), Moden
patent: 6506626 (2003-01-01), Chiu
patent: 6507114 (2003-01-01), Hui et al.
patent: 6509643 (2003-01-01), Ohtaka et al.
patent: 6534848 (2003-03-01), Dornbos et al.
patent: 6537857 (2003-03-01), Aquien et al.
patent: 6544812 (2003-04-01), Camenforte et al.
patent: 6611052 (2003-08-01), Poo et al.
patent: 6664617 (2003-12-01), Siu
patent: 6784525 (2004-08-01), Kuan et al.
patent: 6791168 (2004-09-01), Connell et al.
patent: 6825569 (2004-11-01), Jiang et al.
patent: 6835599 (2004-12-01), Kuan et al.
patent: 6841883 (2005-01-01), Farnworth et al.
patent: 6853064 (2005-02-01), Bolken et al.
patent: 6858467 (2005-02-01), Moden

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