Semiconductor component and method of manufacture

Details Semiconductor component and method of manufacture Semiconductor component and method of manufacture

1997-08-01

1999-10-05

Niebling, John F.

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

438112, 438118, 438127, 257676, H01L 2144, H01L 2148, H01L 2150, H01L 2166, G01R 3126

Patent

active

059637820

ABSTRACT:
A semiconductor component can be manufactured by providing a leadframe (12) with leads (13) and a flag (14) substantially coplanar with at least one of the leads (13) wherein the flag (14) has a hole (15). An electronic substrate (11) is adhered to the flag (14) wherein a perimeter of the electronic substrate (11) has bonding pads (21), wherein the bonding pads (21) face toward the flag (14), wherein the electronic substrate (11) covers the hole (15), and wherein the flag (14) is absent over the bonding pads (21). Next, the pads (21) are wire bonded to the leads (13), and then the electronic substrate (11) and the leadframe (12) are encapsulated with a packaging material (17) wherein the packaging material (17) has an opening (23) and is devoid of covering the hole (15) in the flag (14).

REFERENCES:
patent: 4699682 (1987-10-01), Takishima
patent: 4942454 (1990-07-01), Mori et al.
patent: 5570454 (1996-10-01), Liu
Machine Design, "Chemical Sensing Carves Out a Niche", vol. 69, No. 11, Jun. 5, 1997, p. 52.

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