Semiconductor component and method of manufacture

Details Semiconductor component and method of manufacture Semiconductor component and method of manufacture

1998-02-02

2000-12-05

Trinh, Michael

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

438 52, 438 53, 438753, H01L 2100

Patent

active

061565857

ABSTRACT:
A semiconductor component comprises a substrate (101), a two flexible pressure sensor diaphragms (106, 303) supported by the substrate (101), and a fixed electrode (203) between the two diaphragms (106, 303). The two diaphragms (106, 303) and the fixed electrode (203) are electrodes of two differential capacitors. The substrate (101) has a hole (601) extending from one surface (107) of the substrate (101) to an opposite surface (108) of the substrate (101). The hole (601) is located underneath the two diaphragms (106, 303), and the hole (601) at the opposite surfaces (107, 108) of the substrate (101) is preferably larger than the hole (601) at an interior portion of the substrate (101).

REFERENCES:
patent: 3853650 (1974-12-01), Hartlaub
patent: 4257274 (1981-03-01), Shimada et al.
patent: 4784721 (1988-11-01), Holmen et al.
patent: 4961821 (1990-10-01), Drake et al.
patent: 5189777 (1993-03-01), Guckel et al.
patent: 5262000 (1993-11-01), Welbourn et al.
patent: 5277068 (1994-01-01), Fukiura et al.
patent: 5332469 (1994-07-01), Mastrangelo
patent: 5344523 (1994-09-01), Fung et al.
patent: 5357807 (1994-10-01), Guckel et al.
patent: 5424650 (1995-06-01), Frick
patent: 5470797 (1995-11-01), Mastrangelo
patent: 5479827 (1996-01-01), Kumura et al.
patent: 5507080 (1996-04-01), Hayashi et al.
patent: 5888845 (1999-03-01), Bashir et al.
J.T. Kung et al., "An Integrated Air-Gap-Capacitor Process for Sensor Applications", IEEE, 1991 International Conference on Solid-State Sensors and Actuators--Digest of Technical Papers, May 1991, pp. 1010-1013.
H. Guckel et al., "Microstructure Sensors", IEDM Technical Digest--International Electron Devices meeting, San Francisco--CA, Dec. 9-12, 1990, pp. 26.1.1-26.1.4.
Jesper Bay et al., "Design of a Silicon Microphone with Differential Read-Out of a Sealed Double Parallel-Plate Capacitor" The 8th International Conference on Solid-State Sensors and Actuators-Eurosensors IX, Digest of Technical Papers, vol. 2, Sessions A7-D13, Papers 232-496, Jun. 25-29, 1995, pp. 700-703.

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