Semiconductor component and method for the manufacturing thereof

Details Semiconductor component and method for the manufacturing thereof Semiconductor component and method for the manufacturing thereof

1994-10-21

1995-07-25

Ngo, Ngan V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257180, 257181, 257720, H01L 2302, H01L 2974

Patent

active

054365023

ABSTRACT:
A semiconductor component comprises a semiconductor body that has its underside secured on a metallic substrate and is joined at its upper side to an auxiliary member composed of a material having great thermal conductivity and which serves as a heat buffer. This auxiliary member increases the loadability of the semiconductor component with respect to additional, thermal stressing pulses.

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patent: 3928093 (1975-12-01), van Tongerboo et al.
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patent: 4764809 (1988-08-01), Sahara et al.
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patent: 4903886 (1990-02-01), Schwarzbauer
patent: 5073521 (1991-12-01), Braden
patent: 5081067 (1992-01-01), Shimizu et al.
8011 Brown Boveri Review, 74 (1987) Nov., No. 11, Baden, Switzerland; P. Leipold et al. "Reliability Tests for Power Semiconductor Modules", pp. 613-619.

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