Semiconductor component and method for the manufacture thereof

Details Semiconductor component and method for the manufacture thereof Semiconductor component and method for the manufacture thereof

1993-02-25

1994-04-05

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437212, 437215, 437221, 228106, 2282351, 2281791, H01L 2160

Patent

active

053004582

ABSTRACT:
A semiconductor component comprises a semiconductor body that has its underside secured on a metallic substrate and is joined at its upper side to an auxiliary member composed of a material having great thermal conductivity and which serves as a heat buffer. This auxiliary member increases the loadability of the semiconductor component with respect to additional, thermal stressing pulses.

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8011 Brown Boveri Review, 74 (1987) Nov., No. 11, Baden, Switzerland; P. Leipold et al "Reliability Tests for Power Semiconductor Modules", pp. 613-619.

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