Semiconductor component

Details Semiconductor component Semiconductor component

1997-06-30

1999-05-04

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257787, 29840, H01L 2328

Patent

active

059006692

ABSTRACT:
A substrate having a vent (20) and a method of forming the vent (20). A substrate (11) has conductive traces (14) and a semiconductor chip attach pad (17) on a top surface and conductive traces (12) and a bonding pad (13) on the bottom surface. A masking layer (18) is formed over the substrate (11) and openings are formed in the masking layer (18) to expose the conductive traces (14) and a semiconductor chip attach pad (17). The vent (20) is formed in the masking layer (18). A semiconductor chip (31) is mounted to the semiconductor chip attach pad (17). During a step of encapsulating the semiconductor chip (31) with a mold compound, the vent (20) provides pressure relief.

REFERENCES:
patent: 5578261 (1996-11-01), Manzione et al.
patent: 5581122 (1996-12-01), Chao et al.
patent: 5640047 (1997-06-01), Nakashima

Affiliated with

Also associated with

Rating

Semiconductor component does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor component, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor component will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1871311