Semiconductor component

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

361728, 361736, 361764, 361765, 361778, 361783, 361807, 257723, 257724, 257676, 257678, 257686, H01L 2500, H05K 114

Patent

active

059128089

ABSTRACT:
A microcomputer module 21 and a memory module 31 are mounted on a mounting substrate 42 in such a manner that first outer leads 23 of the microcomputer module 21 and first outer leads 33 of the memory module 31 are connected together in an overlapped manner.

REFERENCES:
patent: 5083189 (1992-01-01), Sawaya
patent: 5138438 (1992-08-01), Masayuki et al.
patent: 5412538 (1995-05-01), Kikinis et al.
patent: 5471369 (1995-11-01), Honda et al.
patent: 5780926 (1998-07-01), Seo

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