Semiconductor clamping device

Details Semiconductor clamping device Semiconductor clamping device

1998-06-08

1999-08-17

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 802, 165185, 174 163, 257727, H05K 720

Patent

active

059402733

ABSTRACT:
The present invention relates to a clamping device for increasing the heat transfer between a semiconductor device and a heat dissipating device. The clamping device comprises a clamp having a pair of cooperating jaws. A resiliently biased pressure distribution member extends from one of the jaws. The pressure distribution member and the other jaw are adapted to hold a semiconductor device in contact with the heat dissipating device. A tie rod extends between the clamp jaws. A collar is provided having a central cavity for holding the semiconductor device within and aligning the semiconductor device with respect to the heat dissipating device and the clamp. The collar also has a channel for engaging the tie rod and aligning the collar such that the semiconductor device is aligned between the pressure distribution member and the opposite clamp jaw.

REFERENCES:
patent: 3786168 (1974-01-01), Jaecklin et al.
patent: 3864607 (1975-02-01), Phillips
patent: 3943426 (1976-03-01), Thiele et al.
patent: 4029141 (1977-06-01), Ferrari et al.
patent: 4338652 (1982-07-01), Romanczuk et al.
patent: 4636917 (1987-01-01), Jouanny
patent: 5392193 (1995-02-01), Robertson, Jr. et al.

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