Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Reexamination Certificate
2005-01-25
2005-01-25
Ngô, Ngân V. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Housing or package filled with solid or liquid electrically...
C257S690000, C257S698000, C257S700000, C257S704000
Reexamination Certificate
active
06847106
ABSTRACT:
One aspect of the invention is a semiconductor circuit comprising a semiconductor die electrically connected to a package substrate through a plurality of electrical contacts. A lid above and substantially parallel to the top surface of the die forms a portion of the semiconductor circuit package. A plurality of lid supports each comprising a post and standoff member collectively create a separation between the lid and top surface of the die.
REFERENCES:
patent: 20030205800 (2003-11-01), Kim et al.
patent: 20040135239 (2004-07-01), Radu et al.
patent: 20040178494 (2004-09-01), Lin et al.
Howard Gregory E.
Swanson Leland S.
Brady III Wade James
Ngo Ngan V.
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
Tung Yingsheng
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