Semiconductor circuit and method of fabricating the same

Details Semiconductor circuit and method of fabricating the same Semiconductor circuit and method of fabricating the same

2011-01-04

2011-01-04

Le, Thao P. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257SE23001

Reexamination Certificate

active

07863748

ABSTRACT:
A bonded semiconductor structure includes a support substrate which carries a first electronic circuit, and an interconnect region carried by the support substrate. The interconnect region includes a capacitor and conductive line in communication with the first electronic circuit. The circuit includes a bonding layer carried by the interconnect region, and a bonded substrate coupled to the interconnect region through the bonding layer.

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