Semiconductor chips suitable for known good die testing

Details Semiconductor chips suitable for known good die testing Semiconductor chips suitable for known good die testing

1996-07-15

1997-12-02

Picardat, Kevin

Fishing, trapping, and vermin destroying

H01L 2144

Patent

active

056935650

ABSTRACT:
A semiconductor integrated circuit (IC) die is made with enhanced resilience to handling, testing, and storage, associated with its qualification and distribution as a KNOWN GOOD DIE (KGD). The IC device has a mechanically tough and chemically inert top layer to protect it from damage. The device contacts are made of thin film metals which facilitate reversible electrical connections used in KGD testing. The overall contact structure protects the device from irreversible damage during the connection, test, and disconnection sequence.

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