Semiconductor chip with recessed bond pads

Details Semiconductor chip with recessed bond pads Semiconductor chip with recessed bond pads

1985-07-29

1986-11-11

Kittle, John E.

Stock material or miscellaneous articles

Composite

Of bituminous or tarry residue

357 56, 29580, 29583, 29591, 428209, H01L 2906, H01L 2108

Patent

active

046225749

ABSTRACT:
A semiconductor chip having bond pads formed on a peripheral ledge recessed below the active chip surface. Ultrasonic wire bonds are made with the pads to lie below the active chip surface.

REFERENCES:
patent: 4142925 (1979-03-01), King et al.
patent: 4523368 (1985-06-01), Feist
patent: 4525732 (1985-06-01), Bayraktaroglu
patent: 4547789 (1985-10-01), Cannella et al.
patent: 4553155 (1985-11-01), Chen et al.

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