Semiconductor chip with bumps and method for manufacturing...

Details Semiconductor chip with bumps and method for manufacturing... Semiconductor chip with bumps and method for manufacturing...

2006-03-14

2006-03-14

Crane, Sara (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S738000, C228S180220, C438S613000, C438S614000

Reexamination Certificate

active

07012334

ABSTRACT:
A method for manufacturing a semiconductor chip with bumps comprises providing a semiconductor chip, which defines an active surface and a back surface and has a plurality of pads disposed on the active surface, and a plurality of preformed solder balls. A passivation is disposed on the active surface of the semiconductor chip with the pads exposed. A plurality of UBMs (Under Bump Metallurgy) are disposed on the pads and define a plurality of bump pads. The diameter of the bump pads is about 100% to about 130% of the diameter of the preformed solder balls. The preformed solder balls are placed on the bump pads and then reflowed to form a plurality of bumps on the semiconductor chip.

REFERENCES:
patent: 6756671 (2004-06-01), Lee et al.
patent: 6805279 (2004-10-01), Lee et al.

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